COB Packaging Technology

2023-12-12 17:01:44 Source： Hits：

The traditional TO coaxial packaging of optical modules has a long assembly process, many components, and high cost. At the same time, it makes optical integration （such as optical hybrid integration or silicon light） more difficult and can no longer meet the rapid development needs of the current digital communication market.

COB packaging technology originated from the LED display industry. Compared to early inline and SMD surface mount packaging, its characteristics are space saving, greatly simplifying packaging operations, effectively solving heat dissipation problems, and improving luminous efficiency.

On the basis of traditional COB packaging, the original independent driver and optical chip are integrated as a whole through high-precision automation equipment, forming a product called an optical engine. The assembly of the optical module is completed by adding a shell to the optical engine.

The COB packaging process has been widely used in the production of digital optical modules due to its advantages of high integration, fully automated production, and significant cost reduction.

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